IC substrates serve as the core component in advanced chip packaging, fulfilling three critical functions: chip protection, electrical interconnection, and thermal management. They surpass conventional PCB capabilities to enable ultra-high-density connectivity between chips and mainboards. Utilizing specialized materials like ABF/BT, they support ultra-fine circuits (line/space to 8μm) and incorporate micro-bumps and redistribution layers for precise I/O connections with sub-micron accuracy. This technology meets rigorous signal and power integrity requirements while enabling advanced architectures like 2.5D/3D integration and chiplets, making it essential for AI, high-performance computing, and premium communication chips.
Craft show
| Layers | 2 -8L |
| Strip Size | 189.0*68.0，70.0*240.0，75.0*240.0， 76.3*240.0， 95.0*240.5etc. |
| Unit Size | 5.4*6.8，8.1*8.1 / 15*16/ 19*19 etc. |
| Material | MGC 832NXA / 832NS / 972 Series Hitachi 705G/ 770G Series AUS308 / AUS 320 / SR1 |
| Finished Thickness | 0.120~0.500 mm |
| Min. Trace Width/Space | 0.025mm / 0.025 mm |
| Product Feature | Impedance,Selected OSP, SM Coining |
| Applications | Wearables，Wireless etc. |
Craft show
| Layers | 2-4L |
| Strip Size | 75.0*240.0，76.3*240.0etc. |
| Unit Size | 1.5*4.0 etc |
| Material | Doosan 7409HGB(LE)/(GQ) Series AUS308 |
| Finished Thickness | 0.500~0.800 mm |
| Min. Trace Width/Space | 0.040mm / 0.040 mm |
| Product Feature | SM Coining |
| Applications | Phone,Wearables,PCetc. |
Craft show
| Layers | 2 ~4 L |
| Strip Size | 66.0*142.0，50.8*188.95，50.8*152.4， 74.0*240.0，75.0*240.0，76.3*240.0etc. |
| Unit Size | 2*2/ 3*3 etc. |
| Material | MGC 832NXA / 832NS Series SYL SI13U / SI10US Series AUS308 |
| Finished Thickness | 0.120~0.500 mm |
| Min. Trace Width/Space | 0.040mm / 0.040 mm |
| Product Feature | SM Coining |
| Applications | Phone,Wearables,PC,Automobileetc. |
Craft show
| Layers | 2 ~4 L |
| Strip Size | 50.8*188.95，187.5*50.0etc. |
| Unit Size | 1.5*4.2 etc. |
| Material | MGC 832NXA / 832NS Series NANYA NPG-180BK / INBK Series AUSMEH / EG23 |
| Finished Thickness | 0.200~0.500 mm |
| Min. Trace Width/Space | 0.040mm / 0.040 mm |
| Product Feature | SM Coining |
| Applications | Phoneetc. |
Craft show
| Layers | 2~4 L |
| Strip Size | 93.81*93.81，189.0*68.0，75.0*240.0， 100.0*103.0，76.3*240.0etc. |
| Unit Size | 1814 / 1612 / 1411 / 1109 etc. |
| Material | MGC 832NS Series Hitachi 705GSeries AUS308 / AUS 320 |
| Finished Thickness | 0.120~0.300 mm |
| Min. Trace Width/Space | 0.025mm / 0.025 mm |
| Product Feature | Coreless Structure,ETS Structure |
| Applications | Phone,Wearablesetc. |
Jiangsu IC Substrate plant
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